应聘条件 |
Job Description:
1.Manage and Lead a team of Process Engineers from Mold, Plating, Mark to Trim Form Singulation .
2.Draw up plans, set goals for Engineers & Drive improvement from analyzing opportunities for improvement & simplification in each process .
3.Provide leadership to solve and disposition process problems that may impact product quality and reliability.
4.Drive Company and Manufacturing goals for process cost improvements without compromising Quality in Form Fit and Function .
5.Interface as required with customers to demonstrate company's assembly process capabilities, including being comfortable and competent in handling a full assembly line audit .
6.Demonstrate and train supporting groups in understanding process variation so they in turn can re_enforce this training across the whole plant to reduce variation and ultimately improve yields, quality and consistency.
Job Requirement:
1. Above eight years experience in semiconductor assembly back-end process engineering,including of Molding/Plating/TNF/Marking.
2.Well versed with Quality System requirements & standards like TS16949, Quality Assurance Control Plans, Quality Tools & Engineering tools like DOE & FMEA .
3.Familiar with semiconductor product application & Reliability requirements like industry test standards such as Jedec, EIAJ .
4.Have knowledge also of supporting industry standards, such as ESD, Clean Room, RoHS, Green initiatives .
5.Possess good understanding of materials used in semiconductor backend manufacturing and their properties and importance in packaging integrity .
6.Candidate major at Automation/Mechanical is perfer.
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